Honor Magic V Flip is generating a buzz ahead of its launch in China, marking Honor’s first foray into the flip foldable smartphone market.
The Magic V Flip appeared on the Geekbench website, offering a deeper glimpse into its chipset & storage capabilities.
The V Flip achieved 1,732 points in the single-core test and 4,431 points in the multi-core test at Geekbench
The device will be powered by Qualcomm chipset with the codename SM8475, known as Qualcomm Snapdragon 8+ Gen 1.
With impressive Geekbench scores, powerful SD 8+ Gen 1 chipset, and storage options, V Flip promises to be a formidable entrant in foldable smartphone market.